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作業(yè)系統(tǒng) Operating system: Windows XP
操作界面Operation interface: 中文界面及觸摸屏操作
Chinese user interface and touch screen
工作周期時(shí)間 Cycle time: 240msec（最快max）{15k/h}
定位精度 Placement accuracy: ±1.5mil
角度精度 Angular accuracy: ±3°
晶片尺寸Applicable die size : 6mil×6mil~100mil×100mil
支持支架 Applicable workholders: 平面LED燈Horizontal LED lamp.
SMD(0603 0805).TOP SMD(3528 5050).
大功率High Power LED
雙視覺系統(tǒng)Dual vision system: 精確及可調(diào)晶片圖像識別定位系統(tǒng)
Precise and modulated pattern recognition system
電源Power supply: 220V±10V. 50Hz, 1.7KW
空氣源（壓力）Air source(Pressure):3~5kg/cm2
其他功能及配置Other features and configuration:
多晶元獨(dú)立控制Multi—Wafer absolute control
漏晶檢查測 Missing die detection
無限程序存儲數(shù)量Unlimited program storage
LCD彩色顯示屏LCD color monitors
內(nèi)置式真空發(fā)生系統(tǒng)Internal vacuum pump system
內(nèi)置不間斷電源系統(tǒng)（UPS）（可選）Internal Uninterrupated Power Supply(UPS){optional}
Demensions and Weight體積和重量
體積[長×寬×高]Demensions[L×W×H]:900mm×800mm×1600mm]
重量Weight: 800kg
Bonding System固晶系統(tǒng)
固晶頭Bond head: 表面吸取式Die surface picking
固晶臂Bond arm: 90°旋轉(zhuǎn)rotatal
固晶力度Bond force: 20g~200g
Wafer XY Table 芯片XY工作臺
最大行程Maximum XY distance: 8”×8”[203mm×203mm]
精確度Accuracy: ±0.3mil 復(fù)測精度Repeatability: ±0.2mil
晶片環(huán)尺寸Wafer size: ￠6”頂針行程Ejector traveling distance: 3mm(max)
Work holder固晶工作臺
最大XY距離Maximum XY distance: 4”×8.5” （105mm×220mm）
精確Accuracy: ±0.3mil
重復(fù)性Repeatability: ±0.2mil